Process for low-temperature surface layer oxidation of a semicon

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 82, 357 52, B05D 512, H01L 21316

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active

042672058

ABSTRACT:
The specification discloses a process for forming a coherent, uniform oxide layer on the surface of a selected semiconductor material by heating a wafer of the selected semiconductor material at a predetermined elevated temperature in an atmosphere conducive to the formation of atomic oxygen for a period of time sufficient to enable the atomic oxygen to react with the surface atoms of the wafer and thus form the coherent, uniform oxide layer. The predetermined elevated temperature is sufficiently low to avoid adverse effects, such as dopant migration, on the wafer. In a preferred embodiment of the present invention, a coherent, uniform layer of silicon dioxide is formed on the surface of a silicon wafer by heating the wafer in a vapor mixture of iodine and water at a temperature of 750.degree. C. and one atmosphere of pressure.

REFERENCES:
patent: Re28385 (1975-04-01), Mayer
patent: 3692571 (1972-09-01), Colton et al.
patent: 4176206 (1979-11-01), Inoue
Hess et al., "Kinetics of the Thermal Oxidation of Silicon in O.sub.2 /HCl Mixtures" Journal of the Electrochemical Soc. 124 (5), 1977, p. 735.
Katz et al., "Defect Formation During High Pressure Low Temperature Steam Oxidation of Si" Journal of Electrochemical Society, 125 (10), 1978, p. 1680.
Blanc, "A Revised Model for the Oxidation of Si by Oxygen" Applied Phys. Lett. 33 (5), Sep. 1, 1978, pp. 424-426.
Irene et al., "Silicon Oxidation Studies: The Role of H.sub.2 O" Journal of the Electrochemical Soc. 124 (11), 1977, p. 1757.
Irene, "The Effects of Trace Amounts of Water on the Thermal Oxidation of Silicon" Journal of Electrochemical Society 121 (12), 1974, p. 1613.
Sunami, "Thermal Oxidation of Phosphorous-Doped Polycrystalline Silicon in Wet Oxygen" Journal of Electrochemical Society 125 (6), 1978, p. 892.

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