Process for long crystal lateral growth in silicon films by...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth from solid or gel state

Reexamination Certificate

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C117S008000, C117S009000, C117S041000, C117S042000, C117S043000

Reexamination Certificate

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07018468

ABSTRACT:
A process of lateral crystallization is provided for increasing the lateral growth length (LGL). A localized region of the substrate is heated for a short period of time. While the localized region of the substrate is still heated, a silicon film overlying the substrate is irradiated to anneal the silicon film to crystallize a portion of the silicon film in thermal contact with the heated substrate region. A CO2laser may be used as a heat source to heat the substrate, while a UV laser or a visible spectrum laser is used to irradiate and crystallize the film.

REFERENCES:
patent: 6495405 (2002-12-01), Voutsas et al.
patent: 6590228 (2003-07-01), Voutsas et al.
patent: 6635554 (2003-10-01), Im et al.
patent: 6635555 (2003-10-01), Voutsas
patent: 6645454 (2003-11-01), Voutsas
patent: 2002/0192956 (2002-12-01), Kizilyalli et al.
patent: 2003/0153111 (2003-08-01), Koyama et al.
Proceeding entitled, “CO2 Laser Crystallization of Silicon on Bulk Fused Silica”, by Hawkins et al., published in Material Research Society Symposia Proceedings vol. 4, pp 529-534, 1982.

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