Metal fusion bonding – Process – Critical work component – temperature – or pressure
Patent
1984-03-07
1985-02-05
Ramsey, Kenneth J.
Metal fusion bonding
Process
Critical work component, temperature, or pressure
B23K 3530
Patent
active
044974299
ABSTRACT:
A process for joining together two or more metal parts using a copper based low melting point metal alloy composition consists essentially of about 10 to 52 atom percent nickel, about 2 to 10 atom percent tin, about 10 to 15 atom percent phosphorus and the balance essentially copper and incidental impurities. The composition is such that the total of copper, nickel and tin ranges from about 85 to 90 atom percent.
REFERENCES:
patent: Re30854 (1982-01-01), Plewes et al.
patent: Re31180 (1983-03-01), Plewes
patent: 1535542 (1925-04-01), Price
patent: 2117106 (1938-05-01), Silliman
patent: 2269581 (1942-01-01), Crampton et al.
patent: 2911298 (1959-11-01), Woodard
patent: 3948432 (1976-04-01), Pryor et al.
patent: 4006838 (1977-02-01), Baumann et al.
patent: 4009027 (1977-02-01), Naidich et al.
patent: 4071358 (1978-01-01), Kawakatsu
patent: 4130421 (1978-12-01), Plewes et al.
patent: 4209570 (1980-06-01), DeCristofaro et al.
patent: 4253870 (1981-03-01), DeCristofaro et al.
patent: 4316573 (1982-02-01), DeCristofaro et al.
patent: 4388270 (1983-06-01), Stavish et al.
A Guide to Preform Soldering, Alloys Unlimited Inc., pp. 1-7, 1959.
Brazing and Soldering Alloys, Part I & II Semiconductor Data, 1962.
Bose Debasis
Datta Amitava
DeCristofaro Nicholas J.
Allied Corporation
Buff Ernest D.
Fuchs Gerhard H,.
Jordan M.
Ramsey Kenneth J.
LandOfFree
Process for joining together two or more metal parts using a hom does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for joining together two or more metal parts using a hom, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for joining together two or more metal parts using a hom will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2079489