Process for in-situ modification of solder comopsition

Details Process for in-situ modification of solder comopsition Process for in-situ modification of solder comopsition

1980-04-10

1982-06-01

Crane, Daniel C.

Metal fusion bonding

Process

Plural heat applying

228180A, 228223, 148 23, 148 24, 420563, 420570, B23K 100, B23K 3526, B23K 35362

Patent

active

043323430

ABSTRACT:
Extraction of non-lead components (e.g. tin, indium, etc.) from solder joints with monocarboxylic acids of alkylated hydrophenanthrene nuclei to increase the lead content of the solder joints.

REFERENCES:
patent: 1782316 (1930-11-01), Rosinoff et al.
patent: 2161556 (1939-06-01), Carroll et al.
patent: 2671264 (1954-03-01), Pessel
patent: 2842841 (1958-07-01), Schnable et al.
patent: 2947079 (1960-08-01), Schnable
patent: 3380821 (1968-04-01), Harvey
patent: 3478414 (1969-11-01), Potter et al.
Manko, Howard H., Solders and Soldering, McGraw-Hill, _Inc., New York, N.Y.,, 1964, pp. 11, 12, 20, 21, 113, 114 and 179.

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