Metal treatment – Compositions – Heat treating
Patent
1988-12-14
1991-05-21
Dean, R.
Metal treatment
Compositions
Heat treating
164468, 164499, 174256, 357 74, C22C 901
Patent
active
050172441
ABSTRACT:
The present invention relates to copper-iron-nickel alloys having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Alloys in accordance with the present invention consist essentially of from 10% to about 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred alloys have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1. The process includes casting the alloy and treating the iron-nickel phase of alloy to minimize its surface volume. The treating step may comprise speroidizing the iron-nickel phase or applying an electromagnetic stirring force to the alloy during the casting step.
REFERENCES:
patent: 1016549 (1912-02-01), Clamer
patent: 1455589 (1923-05-01), Kirk et al.
patent: 1491913 (1924-04-01), Kirk et al.
patent: 1811032 (1931-06-01), Smith et al.
patent: 2074604 (1937-03-01), Bolton et al.
patent: 2196824 (1940-04-01), Dahl et al.
patent: 2347543 (1944-04-01), Dannohl et al.
patent: 4420441 (1983-12-01), Singer
patent: 4457355 (1984-07-01), Winter et al.
patent: 4465118 (1984-08-01), Dantzig et al.
patent: 4482012 (1984-11-01), Young et al.
patent: 4569692 (1986-02-01), Butt
patent: 4642146 (1987-02-01), Ashok et al.
patent: 4661178 (1987-04-01), Ashok et al.
patent: 4711661 (1987-12-01), Kemp, Jr. et al.
Cunife-I, Alloy Digest, published by Engineering Alloys Digest, Inc., Aug., 1961.
Crane Jacob
Fister Julius C.
Sankaranarayanan Ashok
Dean R.
Kieser H. Samuel
Olin Corporation
Phipps Margery S.
LandOfFree
Process for improving the electrical conductivity of a copper-ni does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for improving the electrical conductivity of a copper-ni, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for improving the electrical conductivity of a copper-ni will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-235668