Process for improving the adhesiveness of electrolessly deposite

Details Process for improving the adhesiveness of electrolessly deposite Process for improving the adhesiveness of electrolessly deposite

1994-12-19

1995-07-25

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

427 96, 427123, 4271261, 427264, 427265, 427270, 4272722, 427282, 4273855, 4274071, 4274191, 4274431, 427493, 427510, 427558, 427559, B05D 302

Patent

active

054360340

ABSTRACT:
Electrolessly deposited metal films having improved adhesion can be obtained by coating the surface of the substrates to be metallized with a formulation consisting of UV-curable varnishes which contain noble metal compounds as activators and, in addition, either fillers or solvents or a combination of fillers and solvents, curing these varnishes by means of UV radiation, followed by electroless metallization of the substrates thus treated.

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patent: 5176743 (1993-01-01), Reichert et al.
patent: 5182135 (1993-01-01), Giesecke et al.
patent: 5200272 (1993-04-01), Sirinyan
Patent Abstracts of Japan, vol. 14, No. 497, Oct. 30, 1990, 2-205686.

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