Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1991-03-18
1993-01-26
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427304, 427305, 427306, 4274431, 106 121, 106 128, C23C 2600
Patent
active
051821354
ABSTRACT:
Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization.
The metal coatings produced are distinguished by good adhesion.
REFERENCES:
patent: 3546009 (1970-12-01), Schneble et al.
patent: 3928670 (1975-12-01), Brummett
patent: 4368281 (1983-01-01), Brummett
patent: 4469714 (1984-09-01), Wada et al.
patent: 4493861 (1985-01-01), Sirinyan
patent: 4575467 (1986-03-01), Sirinyan et al.
patent: 4585502 (1986-04-01), Uozn
patent: 4590115 (1986-05-01), Cassat
patent: 4764401 (1988-08-01), Sirinyan
patent: 4830714 (1989-05-01), Sirinyan
patent: 4832989 (1989-05-01), Giesecke
patent: 4910045 (1990-03-01), Giesecke
patent: 4913768 (1990-04-01), Wolf
R. Cannizzaro, "Applications of Polyimide Materials in Electronic Circuitry", Solid State Technology, Nov. 1969, pp. 31-38.
Julius Grant, "Hackh's Chemical Dictionary", McGraw-Hill Book Co., 4th edition, p. 527.
Giesecke Henning
Muller Hanns P.
VON Gizycki Ulrich
Wienkenhover Martin
Wolf Gerhard D.
Bayer Aktiengesellschaft
Beck Shrive
Dang Vi Duong
LandOfFree
Process for improving the adherency of metallic coatings deposit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for improving the adherency of metallic coatings deposit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for improving the adherency of metallic coatings deposit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1411863