Process for improving polymer substrate properties, and modified

Stock material or miscellaneous articles – Composite – Of polyamide

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4273934, 4273935, 4284758, 4284763, 428483, 428515, 428516, 428520, B32B 2708, B32B 2734

Patent

active

046720057

ABSTRACT:
A process for improving the hygroscopic and soil release properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water soluble vinyl monomer and a hydrophobic vinyl monomer at a temperature of between about 40.degree. C. to 100.degree. C., and initiating polymerization of the water-soluble monomer by a chemical or physical initiator to form a vinyl polymer evenly disposed on the substrate. The hygroscopic and soil release properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic vinyl monomer is emulsified by an appropriate emulsifying agent. The invention also pertains to the improved substrates prepared in accordance with the present process.

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