Process for improving copper-epoxy adhesion

Details Process for improving copper-epoxy adhesion Process for improving copper-epoxy adhesion

1982-04-28

1984-01-31

Morgenstern, Norman

Coating processes

With pretreatment of the base

Metal base

148 614R, 156330, 204 29, 204140, B05D 314

Patent

active

044289871

ABSTRACT:
The present invention is directed to a method for improving the adhesion of epoxy resins to copper substrates which comprises pretreating the copper substrate with a solution of a suitable pretreatment compound such as a benzotriazole, benzothiazole, substituted benzotriazoles, etc.

REFERENCES:
patent: 2640037 (1953-05-01), Parry et al.
patent: 2651589 (1953-09-01), Shokal et al.
patent: 2658885 (1953-11-01), D'Alelio
patent: 3336241 (1967-08-01), Shokal
patent: 3477990 (1969-11-01), Dante
patent: 3645772 (1972-02-01), Jones
patent: 3753882 (1973-08-01), Missel
patent: 3756984 (1973-09-01), Klaren et al.
patent: 3762939 (1973-10-01), Hunter

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