Process for improved wall definition of an additive printed circ

Details Process for improved wall definition of an additive printed circ Process for improved wall definition of an additive printed circ

1982-06-17

1985-07-02

Lawrence, Evan K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

204 15, 204 384, 427259, 427307, 430271, 430273, 430311, 430315, B05D 310, B05D 512

Patent

active

045268100

ABSTRACT:
A method which is particularly suitable to the manufacture of printed circuit boards of high resolution comprises the steps of forming a photoresist pattern having an ink coating over a substrate and subsequently depositing a species catalytic to electroless plating on the exposed substrate surface and then forming a flash electroless deposit thereon. The ink coating is then removed together with any overlying deposit leaving the photoresist intact so as to prevent spreading of the deposited flash metal pattern during the subsequent step of full buildup electroless and/or electrolytic plating.

REFERENCES:
patent: T825262 (1969-11-01), Yackel
patent: 2279567 (1942-04-01), Holman
patent: 3773514 (1973-11-01), Fromson
patent: 4002478 (1977-01-01), Kokawa et al.
patent: 4115120 (1978-09-01), Dyer et al.
patent: 4180604 (1979-12-01), Feng et al.
patent: 4200668 (1980-04-01), Segal et al.

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