Process for imparting a better adhesion between reinforcing mate

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Rod – strand – filament or fiber

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427387, 427419G, 428392, 428404, 528425, 32B 2520, B32B 900

Patent

active

041587146

ABSTRACT:
A process is described for imparting a better adhesion between reinforcing materials and a plastic matrix, characterized in that it comprises the steps of treating the reinforcing material surface with at least one organic compound of a tetravalent metal selected from the group consisting of zirconium and tin, at a temperature ranging from 250.degree. to 650.degree. C., of applying onto the reinforcing material surface so treated, at a lower temperature, at least one silane coupling agent and, finally, of drying the so-treated reinforcing material.

REFERENCES:
patent: 2671033 (1954-03-01), Waggoner
patent: 2710267 (1955-06-01), Boyd et al.
patent: 2736721 (1956-02-01), Dexter
patent: 2920981 (1960-01-01), Whitehurst
patent: 2965515 (1960-12-01), Jellinek
patent: 3151099 (1964-09-01), Ceyzeriat et al.
patent: 3418162 (1968-12-01), Adachi
patent: 3627565 (1971-12-01), Plueddemann
patent: 3920596 (1975-11-01), Furukawa
patent: 3927165 (1975-12-01), Grochol et al.
patent: 3958073 (1976-05-01), Trevisan et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for imparting a better adhesion between reinforcing mate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for imparting a better adhesion between reinforcing mate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for imparting a better adhesion between reinforcing mate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-56587

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.