Process for imaging multi-layer resist structure

Details Process for imaging multi-layer resist structure Process for imaging multi-layer resist structure

1988-06-16

1990-02-27

Michl, Paul R.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430191, 430312, 430165, G03C 518

Patent

active

049045644

ABSTRACT:
An image is provided by depositing a first layer of a photoresist containing a phenolic-formaldehyde novolak type polymer and an imidazole, benzimidazole, triazole, or indazoles to increase the solubility of the layer in aqueous alkaline developer after exposure to imaging radiation; depositing on the first layer a second layer of a photoresist containing a phenolic-formaldehyde novolak type polymer; the second layer having a lower degree of solubility in aqueous alkaline developer after exposure to imaging radiation; exposing the layers to imaging radiation; and developing the layers.

REFERENCES:
patent: 3661582 (1972-05-01), Broyde
patent: 4238559 (1980-12-01), Feng et al.
patent: 4564584 (1986-01-01), Fredericks et al.
Novolac Resins Used in Positive Resist Systems, T. R. Pampalone, Solide State Technology, Jun. 1984, pp. 115-120.

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