Process for high speed nickel and gold electroplate system and a

Details Process for high speed nickel and gold electroplate system and a Process for high speed nickel and gold electroplate system and a

1982-08-16

1983-10-25

Kaplan, G. L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

204 40, 204 49, C25D 512

Patent

active

044119658

ABSTRACT:
A method of electrodepositing a gold alloy layer having improved corrosion protection is disclosed. Prior to the gold layer an underlayer of ductile, low-stress nickel is electrodeposited from a solution containing ortho-formyl benzene sulfonic acid and perfluorocyclohexyl potassium sulfonate.

REFERENCES:
patent: 2905601 (1959-09-01), Rinker et al.
patent: 3364064 (1968-01-01), Wijburg
patent: 3708405 (1973-01-01), Kamata
patent: 4016050 (1977-04-01), Lesh et al.

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