Process for high resolution photoimageable dielectric

Details Process for high resolution photoimageable dielectric Process for high resolution photoimageable dielectric

1997-05-08

1999-11-30

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428418, 428901, 174258, 174262, 430 14, 430 18, 4302801, B32B 300, G03C 300

Patent

active

059939451

ABSTRACT:
A novel process for circuitizing a dielectric layer, particularly for adding wiring planes, which is employed in the fabrication of circuitized structures, that does not requiring drilling of vias, yet provides good adhesion of circuitization to dielectric layer. In its broadest sense the method comprises the following steps: a. providing: a substrate; a hydrophobic, uncured, photoimagable, dielectric film having a solvent content of from about 5 to 30%; metal foil; b. contacting the metal foil and the dielectric film so that a replicate image is formed in the dielectric film; c. disposing the dielectric film on the substrate either after step a or step b; d. etching the metal foil from the dielectric film after step c; e. after step d, photoimaging the dielectric film to form vias or through holes in the dielectric film; and then metallizing the film after step e, to provide circuitization atop the dielectric film. The invention also relates to the circuitized structures produce by the method.

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