Process for high density interconnection of substrates and integ

Details Process for high density interconnection of substrates and integ Process for high density interconnection of substrates and integ

1993-04-15

1995-03-28

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437215, 437184, 257776, 257522, H01L 2128, H01L 2156, H01L 2160, H01L 2158

Patent

active

054016878

ABSTRACT:
In a method for preserving an air bridge structure on an integrated circuit chip used in an overlay process, a patternable protective layer is applied for providing mechanical strength to prevent deformation during subsequent processing. A polymeric film layer is applied over the chip and protective layer, and interconnections are fabricated through the polymeric film layer. The polymeric film layer is removed from the area over the air bridge structure. The patternable protective layer is then removed, leaving the resultant structure with an undamaged air bridge which is free of residue.

REFERENCES:
patent: 4617085 (1986-10-01), Cole, Jr. et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4903110 (1990-02-01), Aono
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 5017509 (1991-05-01), Tuckerman
patent: 5073814 (1991-12-01), Cole, Jr. et al.
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5169678 (1992-12-01), Cole et al.
patent: 5206712 (1993-04-01), Kornrumpf et al.
patent: 5264246 (1993-11-01), Ikeno

Affiliated with

Also associated with

Rating

Process for high density interconnection of substrates and integ does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for high density interconnection of substrates and integ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for high density interconnection of substrates and integ will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2250239