Chemistry: electrical and wave energy – Processes and products
Patent
1977-07-20
1978-06-06
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204224R, C25D 502, C25D 508, C25D 516
Patent
active
040935205
ABSTRACT:
The invention is a process for rapidly electroplating certain metals such as gold, nickel, tin-nickel and tin-lead alloys on contact fingers for electronic printed wiring boards. Particularly important is uniform distribution of current amongst the fingers so as to produce uniform metal platings with equal thickness. Also of importance is the provision to alter thickness among the individual fingers so as to plate metal where most needed for particular applications. Uniform and rapid plating are achieved by certain circuit designs together with high parallel flow rates of electroplating solution in the electroplating cell. Both electroplating uniformity and provision for selecting thickness for individual fingers permits savings in amounts of metal used without sacrifices in performance. This is particularly important in the case of gold electroplating because of the high cost and increasing use of gold.
REFERENCES:
patent: 1411657 (1922-04-01), Duncan
patent: 2505531 (1950-04-01), Ellwood
patent: 3644181 (1972-02-01), Donaldson
patent: 3880725 (1975-04-01), Van Raalte
patent: 3933615 (1976-01-01), Levenson
Koontz Donald Eldridge
Landau Uziel
Bell Telephone Laboratories Incorporated
Nilsen Walter G.
Tufariello T. M.
LandOfFree
Process for gold plating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for gold plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for gold plating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1491494