Process for forming thin films by plasma CVD for use in the prod

Fishing – trapping – and vermin destroying

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437241, H01L 21316, H01L 21318

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055255507

ABSTRACT:
A silicon oxide film is formed by a CVD process, with the use of a silane group gas and water as a main feed gas. Further, a film including silanol is formed by the plasma CVD process with a specific plasma energy, using the silane group gas and water as the main feed gas. The specific plasma energy is selected at 40 (W.multidot..degree.C./cm.sup.2) or below. By annealing this film including silanol, or by performing the oxygen plasma process or the ammonia plasma process, the oxide film or the nitride film is formed.

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"Formation of Plasma CVD-SiO.sub.2 Using H.sub.2 O and SiH.sub.4 ", Kato et al., Extended Abstracts (The 53rd Autumn Meeting, 1992), The Japan Society of Applied Physics, p. 577, with English Translation.

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