Process for forming solder lands in a printed wiring board manuf

Details Process for forming solder lands in a printed wiring board manuf Process for forming solder lands in a printed wiring board manuf

1990-03-05

1992-02-25

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174253, 174256, 427259, H05K 302

Patent

active

050901206

ABSTRACT:
A process of forming solder lands in a printed wiring board manufacturing method is disclosed. The process comprises a step of forming a wiring circuit of a required pattern by a copper foil provided on an electrical insulating sheet, a step of forming required solder resists on the wiring circuit, a preprinting step for leveling the surface of the wiring circuit and a step of printing required solder resist on the wiring circuit.

REFERENCES:
patent: 4767892 (1988-08-01), Kobari
patent: 4779339 (1988-10-01), Ohtami et al.

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