Process for forming silver conductors on a substrate

Coating processes – Electrical product produced – Welding electrode

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427 96, B05D 306

Patent

active

047627328

ABSTRACT:
The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink.

REFERENCES:
patent: 3982941 (1976-09-01), Inskip
patent: 4049844 (1977-09-01), Bolon et al.
patent: 4079156 (1978-03-01), Youtsey et al.
patent: 4404237 (1983-09-01), Eichelberger et al.
patent: 4666818 (1987-05-01), Lake et al.

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