Process for forming reflowable immersion tin lead deposit

Details Process for forming reflowable immersion tin lead deposit Process for forming reflowable immersion tin lead deposit

1991-10-03

1992-12-22

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 112, 106 113, 106 118, 106 123, 106 126, 427 97, 427 98, 427436, 427437, 4274431, 205125, C23C 2004, C23C 1854, C23C 1831, C23C 1816

Patent

active

051731096

ABSTRACT:
An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500.degree. F. over a cupreous surface. The displacement plating solution contains stannous ions in an amount of from 0.05 to 0.50 moles per liter, plumbous ions in an amount of from 0.01 to 0.15 moles per liter, a total content of stannous ions and plumbous ions in an amount of from 0.05 to 0.60 moles per liter and a ratio of stannous ions to plumbous ions varying from about 1.0:3.0 to 50.0:1.0. The solution is characterized by an ability to plate the tin lead alloy at a plating rate of at least 100 microinches per 15 minutes. The deposit obtained is capable of reflow and is useful in the manufacture of printed circuit boards.

REFERENCES:
patent: Re30434 (1980-11-01), Davis
patent: 4027055 (1977-05-01), Schneble, Jr.

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