Process for forming printed circuits

Details Process for forming printed circuits Process for forming printed circuits

1991-06-17

1992-03-03

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205167, 205926, C25D 502

Patent

active

050929674

ABSTRACT:
Printed electrical circuits are formed by coating an electrically insulating substrate with a layer of nickel metal followed by electroplating a second metal layer in a pattern of the desired circuit. Exposed nickel is removed from the substrate by reacting it with carbon monoxide to form nickel carbonyl vapor while the second metal remains unreacted. The nickel carbonyl vapor is heated to form nickel metal and carbon monoxide.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser

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