Process for forming polyimide-metal laminates

Details Process for forming polyimide-metal laminates Process for forming polyimide-metal laminates

1991-11-18

1994-06-21

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174257, H05K 100

Patent

active

053229762

ABSTRACT:
Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.

REFERENCES:
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 4464704 (1984-08-01), Huie et al.
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 5066545 (1991-11-01), Walsh

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