Process for forming polyimide-metal laminates

Details Process for forming polyimide-metal laminates Process for forming polyimide-metal laminates

1994-06-16

1995-12-26

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205167, 205182, 205224, 205917, 205920, 205926, 427306, 427307, 427444, C25D 556

Patent

active

054784620

ABSTRACT:
Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.

REFERENCES:
patent: 4806395 (1989-02-01), Walsh
patent: 4832799 (1989-05-01), Knudsen
patent: 4894124 (1990-01-01), Walsh et al.
patent: 4910045 (1990-03-01), Giesecke et al.
patent: 4917761 (1990-04-01), Keep
patent: 4959121 (1990-09-01), Dumas et al.
patent: 5066545 (1991-11-01), Walsh
Julius Grant, editor, Hackh's Chemical Dictionary, McGraw-Hill Book Co., New York, fourth edition, 1969, pp. 302-303.

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