Process for forming planarized films

Details Process for forming planarized films Process for forming planarized films

1989-04-13

1991-05-21

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 41, 427250, 4272551, 4272552, 427377, 4273831, 156643, C23C 1608, C23C 1626, C23C 1650, C23C 1656

Patent

active

050174037

ABSTRACT:
A planarization process and apparatus which employs plasma-enhanced chemical vapor deposition (PECVD) to form plarnarization films of dielectric or conductive carbonaceous material on step-like substrates.

REFERENCES:
patent: 4524089 (1985-06-01), Haque et al.
patent: 4626448 (1986-12-01), Hays
patent: 4663183 (1987-05-01), Ovshinsky et al.
patent: 4681653 (1987-07-01), Purdes et al.
patent: 4889767 (1989-12-01), Yokoyama et al.
VLSI Technology, Second Edition, Edited by S. M. Sze, AT&T Bell Laboratories, pp. 227-228, 1988, 1983.

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