Process for forming photoresist pattern in semiconductor device

Details Process for forming photoresist pattern in semiconductor device Process for forming photoresist pattern in semiconductor device

1996-12-26

1999-04-06

Geist, Gary

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Passivating of surface

4302701, 430197, 438974, 438976, 438694, H01L 2118

Patent

active

058917497

ABSTRACT:
The present invention discloses a process for forming a photoresist pattern in a semiconductor device. In this process, first, a semiconductor substrate where an objective layer for the formation of a pattern is formed thereon, is provided. Afterwards, an alkaline aqueous solution is formed on the semiconductor substrate using either spray, coating, or deposition method. Thereafter, a priming step is performed. Lastly, a photoresist pattern is formed on the semiconductor substrate.

REFERENCES:
patent: 4882260 (1989-11-01), Kohara et al.
patent: 5332648 (1994-07-01), Kihara et al.
CA:122:44316 Abs of JP06275504, 1994.
Silicon Processing vol. 1 Lattice Press. Chapter 4 "Basics of thin film processing" pp. 109-110, 1986.

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