Process for forming passivated metal interconnection system with

Details Process for forming passivated metal interconnection system with Process for forming passivated metal interconnection system with

1975-05-01

1976-10-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

96 362, 156 2, 156 13, 156 17, 204192, 427 90, 427 91, 427264, H01L 21312, H01L 21443

Patent

active

039855970

ABSTRACT:
A process for forming an embedded interconnection metallurgy system on a substrate by (1) forming a first layer of an organic thermosetting polymerized resin material on the substrate, (2) forming a second overlying layer of a material that is soluble in a solvent that does not appreciably affect the material of the first layer, (3) forming a third layer resistant to reactive ion etching in O.sub.2 on the second layer, (4) masking the third layer to define the pattern of the desired metallurgy, (5) removing the exposed areas of the third layer, (6) reactive ion etching the resultant exposed areas of the first and second layers, (7) depositing a conductive metal with a thickness approximately matching the thickness of the first layer, and (8) exposing the substrate to a solvent selective to the material of the second layer thereby removing it and the overlying portions of the conductive metal layer.

REFERENCES:
patent: 3498833 (1970-03-01), Lehrer
patent: 3700497 (1972-10-01), Epifano et al.
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3799777 (1974-03-01), O'Keefe et al.
patent: 3849136 (1974-11-01), Grebe

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