Process for forming multilayer lift-off structures

Details Process for forming multilayer lift-off structures Process for forming multilayer lift-off structures

1997-01-31

1998-06-16

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaged product

Multilayer

430 9, 430 11, G03F 700

Patent

active

057668086

ABSTRACT:
A process is disclosed for forming multilayered polyimide structure from negative photosensitive polyimide precursors. An initial polyimide layer is deposited and imagewise exposed. The unexposed portions of the initial polyimide layer are inhibited and then a second polyimide layer is deposited and likewise imagewise exposed. The films are developed, thereby forming a multilayer polyimide structure. After formation of the multilayer polyimide structure, a conductive material is applied on a substrate and then the polyimide layers are lifted off thereby forming a desired pattern of metallization.

REFERENCES:
patent: 5120622 (1992-06-01), Hanrahan
patent: 5229257 (1993-07-01), Cronin
patent: 5266446 (1993-11-01), Chang

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