Process for forming multi-layer electronic structures including

Details Process for forming multi-layer electronic structures including Process for forming multi-layer electronic structures including

1998-01-05

2000-08-08

Hughes, S. Thomas

Metal working

Method of mechanical manufacture

Electrical device making

174262, 361777, 29830, 29832, H05K 330

Patent

active

060982802

ABSTRACT:
A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material. The at least one core includes a plurality of plated through holes formed therethrough. At least one pad is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device and also prevents solder from entering the at least one plated through hole.

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