Process for forming metallic ground grid for integrated circuits

Details Process for forming metallic ground grid for integrated circuits Process for forming metallic ground grid for integrated circuits

1978-05-16

1979-11-20

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29590, 29591, 204 15, B01J 1700

Patent

active

041745620

ABSTRACT:
A metallic ground grid is fabricated by forming a conductor on the isolation barrier of an integrated circuit through openings in a first insulated layer to a depth less than the first insulated layer, forming a second insulated layer on said first conductor to the height of the first insulated layer, and interconnecting selected areas of the integrated circuit and the first conductor through openings in the insulated layers by a second conductor.

REFERENCES:
patent: 3498833 (1970-03-01), Lehser
patent: 3567508 (1971-03-01), Cox
patent: 3581165 (1971-05-01), Seelbach
patent: 3766445 (1973-10-01), Reuter
patent: 3838442 (1974-09-01), Humphreys

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