Coating processes – Electrical product produced – Condenser or capacitor
Patent
1983-11-30
1985-09-03
Smith, John D.
Coating processes
Electrical product produced
Condenser or capacitor
156643, 427 96, 427226, 427259, 427 91, 427 99, 430314, 430329, 430330, H01L 21285
Patent
active
045392226
ABSTRACT:
A process for forming a desired metal pattern on a substrate which comprises forming a mask of a thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern, blanket coating the substrate and the mask with a metal, heating to depolymerize the thermally depolymerizable polymer, and removing the thermally depolymerizable polymer and metal thereover in a mild solvent.
REFERENCES:
patent: 3535137 (1970-10-01), Haller et al.
patent: 3934057 (1976-01-01), Moreau et al.
patent: 3985597 (1976-10-01), Zielinski
patent: 4004044 (1977-01-01), Franco et al.
patent: 4181755 (1980-01-01), Liu et al.
patent: 4224361 (1980-09-01), Romankiw
patent: 4272561 (1981-06-01), Rothman et al.
patent: 4328263 (1982-05-01), Kurahashi et al.
Gregor et al., "Method for Use and Removal of Photosensitive Chemical Resist Layers" IBM TDB, vol. 7, No. 11, Apr. 1965.
IBM Technical Disclosure Bulletin, "Solventless Development of Polymeric Films" C. A. Cortellino et al., vol. 15, No. 1, Jun. 1972, p. 174.
IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, pp. 541 and 542.
Photoresist Materials and Process, W. S. DeForest, McGraw-Hill, pp. 24, 25, 28, 29 and 60 (1975).
Anderson, Jr. Herbert R.
Araps Constance J.
Lotsko Catherine A.
International Business Machines - Corporation
Smith John D.
LandOfFree
Process for forming metal patterns wherein metal is deposited on does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for forming metal patterns wherein metal is deposited on, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming metal patterns wherein metal is deposited on will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-613260