Process for forming metal layers

Details Process for forming metal layers Process for forming metal layers

2004-06-16

2008-08-26

Tsoy, Elena (Department: 1792)

Coating processes

Applying superposed diverse coating or coating a coated base

C427S099500, C427S252000, C427S258000, C427S404000, C427S405000, C427S407100, C427S409000, C427S437000, C427S443100

Reexamination Certificate

active

07416763

ABSTRACT:
A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.

REFERENCES:
patent: 4269897 (1981-05-01), Gans et al.
patent: 4728399 (1988-03-01), Moehwald
patent: 6015613 (2000-01-01), Kinlen et al.
patent: 6045713 (2000-04-01), Tamiya et al.
patent: 6093499 (2000-07-01), Tomioka
patent: 2002/0155021 (2002-10-01), Nagai
patent: 2006/0070870 (2006-04-01), Schettler et al.
patent: 1180917 (2002-02-01), None
patent: 63312936 (1988-12-01), None
patent: 2270946 (1990-06-01), None
patent: H5-287582 (1993-11-01), None
patent: H6-81190 (1994-03-01), None
patent: 10081927 (1998-03-01), None
patent: 200282156 (2000-10-01), None
patent: 2001-85397 (2001-03-01), None
patent: 2001131661 (2001-05-01), None
Office Action with English language translation from corresponding Japanese application No. 2003-173705, mailed on Dec. 21, 2007.

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