Process for forming lead frame of quad flat semiconductor packag

Details Process for forming lead frame of quad flat semiconductor packag Process for forming lead frame of quad flat semiconductor packag

1993-06-15

1994-12-27

Larson, Lowell A.

Wireworking

Crimping

B21F 4500

Patent

active

053756304

ABSTRACT:
A roll forming process and roll forming apparatus of a lead frame of quad flat a semiconductor package. The roll forming process comprises a roll forming step for bending using a form roller the plurality of leads into a predetermined bending shape while minimizing the frictional force between the form roller and the leads and a notching step for providing a pair of notches on the lead frame at opposite sides of the leads. The roll forming step is carried out between the trimming step and the lead cutting step, while the notching step is carried out at least before the roll forming step. The roll forming apparatus comprises a roll forming punch die including the form roller rotatably supported at its opposite sides by a pair of support holders. The form roller imparts an increasing bend to the package leads until the predetermined bending shape is achieved.

REFERENCES:
patent: 4103718 (1978-08-01), Steigerwald
patent: 4558581 (1985-12-01), Goulstone et al.
patent: 5074139 (1991-12-01), Elliot
patent: 5135034 (1992-08-01), Miyamoto

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