Process for forming layered coated film, and layered coated...

Details Process for forming layered coated film, and layered coated... Process for forming layered coated film, and layered coated...

2006-02-28

2006-02-28

Mayekar, Kishor (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Electrophoresis or electro-osmosis processes and electrolyte...

C204S506000, C523S415000

Reexamination Certificate

active

07005051

ABSTRACT:
Disclosed is a three coat one bake coating process for forming an intermediate coated film, a base coated film and a clear coated film on an electrodeposition coated film. The electrodeposition coating composition is a lead-free cationic electrodeposition coating composition which has a volatile organic content of 1% by weight or less, a metal ion content of 500 ppm or less, a neutralizing acid amount of 10 to 30 mg equivalent based on 100 g of binder resin solid content. The intermediate coating composition and/or the base coated composition comprises a specific amount of a nonaqueous dispersion resin as a resin component. In the coating process, a baking step is omitted from the conventional intermediate coating process, or from the conventional base coating process.

REFERENCES:
patent: 5536804 (1996-07-01), Yamada et al.
patent: 5770642 (1998-06-01), Kanato et al.
patent: 6165621 (2000-12-01), Kasari et al.
patent: 6353057 (2002-03-01), He et al.
patent: 6428856 (2002-08-01), Masuda et al.
patent: 2002-38104 (2002-02-01), None

Affiliated with

Also associated with

Rating

Process for forming layered coated film, and layered coated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming layered coated film, and layered coated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming layered coated film, and layered coated... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3710185