Process for forming interconnections in a multilayer circuit boa

Details Process for forming interconnections in a multilayer circuit boa Process for forming interconnections in a multilayer circuit boa

1970-11-06

1977-06-28

Andrews, R. L.

Chemistry: electrical and wave energy

Processes and products

204 38R, 427259, 427282, 427264, C25D 502

Patent

active

RE0292842

ABSTRACT:
Electronic interconnections are formed between a plurality of layers of multilayer board by first applying a removable and reuseable dielectric mask over the surface of a circuit pattern formed on an insulating layer. The mask includes a pattern of openings which define locations for forming interconnecting members between portions of said circuit pattern and a subsequently formed circuit pattern. After the openings have been filled, the removable mask is replaced by a permanent insulating layer. The process of applying the mask and filling the openings is repeated to produce a multilayer board having a plurality of layers.

REFERENCES:
patent: 2728693 (1955-12-01), Cado
patent: 2966429 (1960-12-01), Darrel et al.
patent: 3188251 (1965-06-01), Straight et al.
patent: 3226255 (1965-12-01), Cieniewicz et al.
patent: 3310432 (1967-03-01), Griest et al.
patent: 3496072 (1970-02-01), Meyers

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