Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1984-06-28
1986-09-16
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228122, 228124, 2281802, 228231, B23K 100
Patent
active
046117466
ABSTRACT:
In accordance with the present invention, we provide a new method for relieving stresses in the device-substrate interconnection structure which greatly enhances the resistance of the interconnection solder bonds to fatigue failure. In accordance with the aforementioned object of the process of our invention for forming improved solder interconnections between integrated circuit semiconductor devices and the supporting substrate, the process includes the step of joining the device I/O pads to the corresponding I/O pads of the substrate by positioning the device over the substrate with solder material selectively positioned between the respective I/O pads, heating the assembly to at least the melting point of the solder material, and cooling to solidify the solder. Subsequently, the resultant device-substrate is annealed by heating to an annealing temperature in the range of 115.degree. to 135.degree. C. and maintaining this temperature for a time in excess of 2 days.
REFERENCES:
patent: 3273979 (1966-09-01), Budnick
patent: 3429040 (1969-02-01), Miller
Levine Ernest N.
Lipschutz Lewis D.
Quinones Horatio
Godici Nicholas P.
International Business Machines - Corporation
Skillman Karen
Stoffel Wolmar J.
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