Process for forming heat-resistant resin films of polyimide and

Details Process for forming heat-resistant resin films of polyimide and Process for forming heat-resistant resin films of polyimide and

1984-02-17

1985-07-09

Childs, Sadie L.

Coating processes

With post-treatment of coating or coating material

Heating or drying

427 96, 4273855, 4284735, B05D 302

Patent

active

045282161

ABSTRACT:
A process for forming heat resistant resin films comprising the steps of admixing a polyimide resin precursor solution, for example, a solution containing a reactant obtained from pyrromellitic dianhydride, 3,3',4,4'-benzophenyltetracarboxylic acid dianhydride, 4,4'-diaminodiphenyl ether, and 4,4'-diaminodiphenyl ether-3-carbonic amide with an organosilicic compound solution, coating a silicon substrate with the resulting admixture, and subjecting said coated silicon substrate to heat treatment.

REFERENCES:
patent: 3682698 (1972-08-01), Palmer et al.
patent: 4101487 (1978-07-01), Peterson
patent: 4467000 (1984-08-01), Economy et al.
Thin Solid Films, 83(1981), pp. 145-163, "Polyimide Insulators for _Multilevel Interconnections".

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