Process for forming fine thick-film conductor patterns

Details Process for forming fine thick-film conductor patterns Process for forming fine thick-film conductor patterns

1997-05-27

2000-06-13

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438107, 438110, 438113, 438460, H01L 2144, H01L 2148, H01L 2150

Patent

active

060748931

ABSTRACT:
A process for forming fine thick-film conductor patterns on a ceramic substrate which comprises the steps of forming grooves in a positive-working photoresist layer on the substrate by the photolithographic technology, filling the grooves with a conductive paste by squeezing with a squeegee, removing the photoresist layer by a wet process, and firing the remaining conductive paste pattern is improved. By the improvements, the conductive paste is squeezed into the grooves by the screen printing technique using a mask, and/or the solvent in the conducive paste consists essentially of one or more hydrocarbons, and/or the squeegee is made of a material having a flexural modulus in a range of 30-200 kgf/mm.sup.2. The formation of the grooves may be accomplished by laser beam machining; in this case a negative-working photoresist or any other soluble resin may be used to form the grooves therein. Also provided are a process for forming a fine thick-film conductor pattern by means of transfer of a conductive paste pattern formed on a support film to a green sheet, as well as a process for forming bumps on a ceramic circuit substrate.

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Grant et al., Grant & Hackh's Chemical Dictionary, Fifth ed., McGraw Hill, Bokk Company, New York, NY 1987, p. 533, "sintering".
The American Heritage Dictionary, Second College Edition, Houghton Mifflin Company, Boston, MA, 1982, pp. 349-350.

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