Process for forming electrode on semiconductor device

Details Process for forming electrode on semiconductor device Process for forming electrode on semiconductor device

1978-06-26

1980-09-23

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

357 15, 357 67, C25D 502, C25D 712, H01L 2946

Patent

active

042241154

ABSTRACT:
Semiconductor substrates electroplated with nickel-palladium alloy consisting of above 50 to 80 atomic percent nickel and below 50 to 20 atomic percent palladium exhibit excellent thermal stability.

REFERENCES:
patent: 3580820 (1971-05-01), Yamamura et al.
patent: 3636417 (1972-01-01), Kimura
patent: 3677909 (1972-07-01), Yamamura et al.
patent: 3699408 (1972-10-01), Shinoda et al.
patent: 3932880 (1976-01-01), Nara et al.

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