Process for forming copper coating having excellent mechanical p

Details Process for forming copper coating having excellent mechanical p Process for forming copper coating having excellent mechanical p

1987-03-09

1988-10-11

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428131, 428137, 428209, 428901, 427 431, 427 541, 427305, 174 685, B32B 300, B05D 306, H01K 500

Patent

active

047770783

ABSTRACT:
A process of forming on a substrate a copper coating which has excellent mechanical properties, comprising depositing copper on the substrate by chemical plating, and forming at least one silver-rich layer during the deposition of copper, each silver-rich layer has a higher content of silver than the other portion of the copper coating. Also disclosed is a process of producing a printed-wiring board by forming such a copper coating.

REFERENCES:
patent: 4082557 (1978-04-01), Pizzio
patent: 4568570 (1986-02-01), Giesecke
patent: 4666744 (1987-05-01), DeLuca et al.

Affiliated with

Also associated with

Rating

Process for forming copper coating having excellent mechanical p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming copper coating having excellent mechanical p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming copper coating having excellent mechanical p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1957703