Process for forming compound semiconductor bodies

Details Process for forming compound semiconductor bodies Process for forming compound semiconductor bodies

1979-01-31

1981-04-14

McCamish, Marion

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29583, 428 64, 428428, H01L 500

Patent

active

042617812

ABSTRACT:
Compound semiconductor bodies are formed by bonding a layer of supporting material to the two opposite faces of a semiconductor wafer and then cutting the semiconductor wafer into two parts in a plane parallel to said faces. The cut surface of each part is then polished.

REFERENCES:
patent: 3422527 (1969-01-01), Gault
patent: 3488835 (1970-01-01), Becke
patent: 3579816 (1971-05-01), Ingraham
patent: 3623219 (1971-11-01), Stoller
patent: 3864819 (1975-02-01), Ying

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