Process for forming circuit with laser

Details Process for forming circuit with laser Process for forming circuit with laser

1994-08-19

1996-06-11

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205125, 205136, 205221, 205917, 205918, C25D 502

Patent

active

055252052

ABSTRACT:
A process for forming an electrical circuit component includes forming an initial metal layer on a surface of a synthetic plastics substrate, and irradiating the initial metal layer with laser light along a closed path so as to remove the initial metal layer therealong. The closed path irradiated by the laser light thereby establishes an insulating region covered by a first portion of the initial metal layer which is bounded by the closed path, and a conducting region covered by a second portion of the initial metal layer which surrounds the closed path and the insulating region established thereby. A further metal layer is then formed over the second portion of the initial metal layer of the conducting region. The first portion of the initial metal layer of the insulating region may thus be removed to thereby expose a corresponding surface portion of the synthetic plastics substrate.

REFERENCES:
patent: 4081653 (1978-03-01), Koo et al.
patent: 4898648 (1990-02-01), Cusano
patent: 4943346 (1990-07-01), Mattelin
Patent Abstracts Of Japan, vol. 14, No. 320 (E-0950) 10 Jul. 1990, abstract of JP-A-02 105 596(Toyama Nippon Denki KK) 18 Apr. 1990.

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