Process for forming an ohmic electrode on a p-type III-V compoun

Coating processes – Electrical product produced – Condenser or capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 91, H01L 21285

Patent

active

046735933

ABSTRACT:
A semiconductor device having an ohmic electrode which has formed on the surface of a p-type III-V compound semiconductor an assembly of a first Ti layer, a second Zn layer, a third metal layer made of one element selected from among Pt, Mo, W and Cr, and a fourth Au layer is disclosed. A process for producing such semiconductor device is also disclosed.
The present invention provides a novel ohmic electrode having a low contact resistance comparable to that of a conventional electrode formed by deposition of successive Au, Zn and Au layers. The novel electrode also has the advantage of another conventional electrode wherein the Au electromigration is held to a minimum by forming an assembly of a Ti layer, a metal layer made of an element selected from among Pt, Mo, W and Cr, and an Au layer.

REFERENCES:
patent: 3987480 (1976-10-01), Diguet
patent: 4395727 (1983-07-01), Lauterbach
patent: 4414561 (1983-11-01), Keramidas
patent: 4471005 (1984-09-01), Cheng
patent: 4510514 (1985-04-01), Camlibel
Su et al, "Low Contact Resistance Nonalloyed Ohmic Contacts to Zn-implanted p.sup.+ GaAs", Electronic Letters, vol. 19, (1983), Oct., pp. 891-892.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for forming an ohmic electrode on a p-type III-V compoun does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming an ohmic electrode on a p-type III-V compoun, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming an ohmic electrode on a p-type III-V compoun will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-683301

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.