Process for forming an encapsulated electronic component having

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438127, 26427217, 264161, H01L 2156, H01L 2168

Patent

active

057390541

ABSTRACT:
A process for manufacturing an encapsulated electronic part having a resin body and a projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body. The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for forming an encapsulated electronic component having does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming an encapsulated electronic component having , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming an encapsulated electronic component having will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-634207

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.