Process for forming a through connection between a pair of circu

Details Process for forming a through connection between a pair of circu Process for forming a through connection between a pair of circu

1974-08-19

1976-07-20

Lanham, C.W.

Metal working

Method of mechanical manufacture

Electrical device making

29628, 174 685, 339 17C, B41M 308

Patent

active

039698157

ABSTRACT:
In a process of forming through connections between metal circuit patterns formed in layers on opposite surfaces of a substrate characterized by forming an aperture through the pair of layers and the substrate, increasing the diameter of the aperture in the substrate, compressing the portions of each metal layer, which portions are overhanging the increased aperture, towards each other and subsequently forming a connection between the compressed portions of the opposite metal layers. Preferably, the apertures are formed by a mechanical operation such as drilling or punching and the substrate aperture is enlarged or widened by a selective etching process without substantially increasing the size of the aperture through the overlying metal layers. The electrical connection may be formed by galvanically depositing metal on the compressed portions to electrically interconnect the two portions, by welding the two portions together, or by applying solder such as during soldering a lead of a component which was inserted into the aperture.

REFERENCES:
patent: 2889393 (1959-06-01), Berger
patent: 2974284 (1961-03-01), Parker
patent: 2977672 (1961-04-01), Telfer
patent: 3037265 (1962-06-01), Kollmeier
patent: 3201851 (1965-08-01), Stearns
patent: 3276106 (1966-10-01), Bester et al.
patent: 3315133 (1967-04-01), Walker
patent: 3335489 (1967-08-01), Grant
patent: 3337711 (1967-08-01), Garscia
patent: 3346950 (1967-10-01), Schick
patent: 3678437 (1972-07-01), Vaden

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