Process for forming a structure which electrically shields condu

Details Process for forming a structure which electrically shields condu Process for forming a structure which electrically shields condu

1992-02-03

1993-11-16

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 61, 257503, 257508, 257759, H01L 2144, H01L 2148

Patent

active

052623530

ABSTRACT:
A shielding structure (10) and method of formation. The shielding structure (10) has a substrate (12). A first dielectric layer (14) overlies the substrate (12). A conductive layer (16) is formed overlying the dielectric layer (14), is patterned, and is etched to form electrically isolated conductive regions from conductive layer (16). The electrically isolated conductive regions have sidewalls and the etching of conductive layer (16) exposes portions of dielectric layer (14). The exposed portions of dielectric layer (14) are etched to form trenched portions of dielectric layer (14). A second dielectric layer (18) is formed overlying the electrically isolated conductive regions, including the sidewalls, and overlying the trenched portions to create recessed regions that separate the electrically isolated conductive regions. A shielding conductive layer (20) is formed overlying dielectric layer (18) and at least partially fills the recessed regions to shield the electrically isolated conductive regions from each another.

REFERENCES:
patent: 5100818 (1992-03-01), Arima et al.
patent: 5110762 (1992-05-01), Nakahara et al.
patent: 5164334 (1992-11-01), Mizushima

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