Process for forming a semiconductor device base array and mounti

Details Process for forming a semiconductor device base array and mounti Process for forming a semiconductor device base array and mounti

1996-02-05

1997-09-09

Graybill, David E.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438113, 438118, 156256, H01L 2148, H01L 2158, H01L 2160, H01L 2170

Patent

active

056656491

ABSTRACT:
A method of manufacturing semiconductor devices is disclosed which incorporates an array of bases formed on a plastic sheet. Each base in the array includes individual leads used to connect the semiconductor die to an external circuit. To keep the plastic sheet from flexing during assembly the plastic sheet is placed between a foundation and an anchor grid, where the foundation provides a rigid platform for the plastic sheet and the anchor grid hold the sheet to the foundation. Once the semiconductor dies have been attached to the bases, a protective cap is placed over the die. An adhesive sheet is then place over all the caps in the array allowing the array to be milled to separate the individual packages without scattering the devices.

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