Adhesive bonding and miscellaneous chemical manufacture – Methods – Delaminating – per se; i.e. – separating at bonding face
Reexamination Certificate
2011-08-23
2011-08-23
Tucker, Philip C (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Delaminating, per se; i.e., separating at bonding face
C156S277000, C156S278000, C156S247000, C156S704000, C156S705000, C427S259000, C427S272000, C427S273000, C427S282000, C438S478000, C438S759000, C438S763000
Reexamination Certificate
active
08002948
ABSTRACT:
A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.
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