Process for forming a morphological edge structure to seal integ

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

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257626, 257638, 257644, 257650, H01L 23544, H01L 2906, H01L 2358

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059694084

ABSTRACT:
A process for the formation of a device edge morphological structure for protecting and sealing peripherally an electronic circuit integrated in a major surface of a substrate of semiconductor material includes formation above an intermediate process structure of a dielectric multilayer comprising a layer of amorphous planarizing material. The process also includes the partial removal of the dielectric multilayer so as to create at least one peripheral termination of the multilayer in the device edge morphological structure. Removal of the dielectric multilayer requires that the peripheral termination thereof be located in a zone of the intermediate process structure relatively higher than the level of the major surface, if compared with adjacent zones of the intermediate structure itself at least internally toward the circuit and in so far as to the device edge morphological structure.

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Kobayakawa Et Al., A Study Of Outgassing From Spin-On-Glass Films, Jun. 11-12, 1991, pp. 454-456.

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