Process for forming a module

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29856, 29883, 26427214, H05K 330

Patent

active

057491437

ABSTRACT:
An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

REFERENCES:
patent: 3816911 (1974-06-01), Knappenberger
patent: 4772761 (1988-09-01), Ibrahim et al.
patent: 4989302 (1991-02-01), Abe et al.
patent: 5589714 (1996-12-01), Howard

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