Process for forming a medical device balloon

Details Process for forming a medical device balloon Process for forming a medical device balloon

2005-03-08

2005-03-08

Colaianni, Michael P. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Including application of internal fluid pressure to hollow...

C264S516000, C264S209100, C264S209300

Reexamination Certificate

active

06863861

ABSTRACT:
A balloon blowing process which involves radial expansion of an extruded tubing segment which has been subjected to a stretching step prior to radial expansion, the process utilizing an internal pressure and a temperature which together cause at least a portion of the tubing to expand to an interior diameter (ID) which is greater than the interior diameter of the extruded segment prior to extrusion.

REFERENCES:
patent: 4490421 (1984-12-01), Levy
patent: 5017325 (1991-05-01), Jackowski et al.
patent: 5087394 (1992-02-01), Keith
patent: 5223205 (1993-06-01), Jackowski et al.
patent: 5270086 (1993-12-01), Hamlin
patent: 5348538 (1994-09-01), Wang et al.
patent: 5556383 (1996-09-01), Wang et al.
patent: 5587125 (1996-12-01), Roychowdhury
patent: 5749851 (1998-05-01), Wang
patent: 5807520 (1998-09-01), Wang et al.
patent: 20030030189 (2003-02-01), Wang et al.
patent: 20030167067 (2003-09-01), Wang et al.
patent: 274 411 (1988-01-01), None
patent: 592 885 (1993-09-01), None
patent: 9717098 (1997-05-01), None
patent: 9732624 (1997-09-01), None
patent: 9944649 (1999-09-01), None
patent: 00002613 (2000-01-01), None

Affiliated with

Also associated with

Rating

Process for forming a medical device balloon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming a medical device balloon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming a medical device balloon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3401921